Nvidia, TSMC

Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia CEO Huang confirms its TSMC advanced packaging needs are shifting: report
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the type of technology it requires is shifting,

Taiwan, TSMC

TSMC’s Mixed Signals: Hold Rating Amid Strong Demand and Future Headwinds
Krish Sankar, an analyst from TD Cowen, maintained the Hold rating on TSMC (TSM – Research Report). The associated price target was raised to ...
Digi Times23h
TSMC expects 5% sequential revenue drop in 1Q25, plans record capex for 2025
TSMC expects to post revenues of between US$25 billion and US$25.8 billion in the first quarter of 2025, representing a ...
Electronic Design9h
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
TweakTown13d
TSMC to begin equipment move-in at its biggest CoWoS packaging plant in Taiwan in April 2025
TSMC to begin equipment move-in at its biggest CoWoS advanced packaging and testing plant, AP8 in the Southern Taiwan Science ...
TSMC's next-gen 2nm silicon is reportedly on track for later this year but don't expect chips for PCs until 2027 and beyond
But it seems Taiwanese megfab TSMC is determined to crank out new silicon regardless. The latest reports claim TSMC's ...
The Next Platform8h
TSMC Can’t Be Caught Or Bought, Only Sought Or Stolen
It is not hard to figure out who is in the catbird seat in the semiconductor foundry business. In 2024, according to CC Wei, ...
TSMC To Deliver A Robust Quarter
TSMC is entering an unprecedented growth phase, driven by accelerating AI infrastructure demand. Check out why I reiterate a ...