A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above stacks ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...