Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.

Austin, Oct. 20, 2025 (GLOBE NEWSWIRE) -- Power Module Packaging Market Size & Growth Insights: According to the SNS Insider,“The Power Module Packaging Market size was valued at USD 2.53 Billion in ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

Brian Narveson, Independent Consultant and PSMA Board Member, and Greg Evans, CEO, WelComm Inc., and PSMA Marketing Committee, contributed to this article. It’s always been inevitable, that in system ...