Samsung plans to replace silicon with glass interposers in AI chip manufacturing by 2028. This groundbreaking shift aims to deliver faster, more efficient AI chips, potentially boosting processing ...
As quantum computers continue to advance, many of today’s encryption systems face the risk of becoming obsolete. A powerful alternative—quantum cryptography—offers security based on the laws of ...
Over the recent years, development around touch screen technology has been primarily driven by smart phones and tablets. As the user experience has made constant improvements, it is time to bring ...
Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...
A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...
Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...
As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.
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