Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...
Santa Cruz, Calif. – To really analyze an IC power delivery system, Sigrity Inc. maintains, you have to include package effects. So the company will roll out a tool this week that's said to ...
How much can one package take? As consumer electronics design features scale down to 45-nm and even 32-nm nodes, IC makers are pushed to the limits to shoehorn more functionality into these packages- ...
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