Imec, headquartered in Leuven, Belgium, has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300 mm silicon wafers, through a unique silicon ...

LAWRENCEVILLE, Ga.--(BUSINESS WIRE)--Silicon Creations, a leading provider of precision IP for advanced SoC design, today announced its 1000th production FinFET tapeout at TSMC, alongside the ...

ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over EUR10 billion (US$11 ...

TSMC 3nm process node is the best FinFET technology and TSMC dominates semiconductor chip fabrication with higher transistor density, better yields on a mature technology and broad adoption by clients ...

TSMC Chairman C.C. Wei will lead around 100 employees tomorrow to a grand event where the leading chip manufacturer will break ground on its first European 12-inch plant in Dresden, Germany, according ...

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TSMC held its North America Technology Symposium on Wednesday, April 23, 2025 at the Santa Clara Convention Center and presented update information on its relentless march to ever finer geometries and ...

The European Commission today approved €5bn in German state aid to support TSMC’s chip plant in Dresden — its first in Europe. Dubbed European Semiconductor Manufacturing Company (ESMC), the fab is a ...

Leuven, Belgium & Hshinchu, Taiwan – October 6, 2009 – IMEC and TSMC today announce that they have forged an Innovation Incubation Alliance to create a platform enabling the development of innovative ...

Milestone highlights long term collaboration with TSMC, robust customer support infrastructure, and leadership in advanced process nodes Silicon Creations, a leading provider of precision IP for ...