Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...

The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping, which ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

KAOHSIUNG, Oct. 23, 2023 /PRNewswire/ -- On September 19, 2023, Intel announced one of the industry's first glass substrates for next-generation advanced packaging. The industry believes that glass ...

Korean electronic components manufacturer LG Innotek said Thursday that it has partnered with glass processing specialist UTI ...

The development of glass-based substrates for electronics in datacentres and high-performance computing is the aim of a consortium gathered by German research institute Fraunhofer IZM (Fraunhofer ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030. Save my User ID and Password Some subscribers prefer to save ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...