With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...
TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...
Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...
The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth memory ...
With the goal of increasing system performance per watt, the semiconductor industry is always seeking innovative solutions that go beyond the usual approaches of increasing memory capacity and data ...
GridGain Systems today announced the availability of what is being touted as the industry’s first end-to-end In-Memory Computing infrastructure stack. The GridGain Stack includes high performance ...
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