A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback