Energy/bit optimization approach for multi-chip systems with possibility of co-optimization with the routing resources defined by the signalling pitch. December 7th, 2022 - By: Fraunhofer IIS/EAS More ...
To meet these industry efficiency trends, Fairchild Semiconductor has developed the FDMF68xx Gen III DrMOS multi-chip module (MCM) family. Designed to enable a reduced inductor and output capacitor ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
Enhancing thermal management in electric vehicle propulsion systems: A focus on optimizing irregular pinfin structures and collaborative design with dc bus capacitors and motors The paper investigates ...
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