Expanded offerings of OCP NIC 3.0 cards enable high-performance, high-efficiency server systems driving next generation computing and storage applications SAN JOSE, Calif., March 13, 2019 (GLOBE ...
SAN JOSE, Calif., March 14, 2019 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ:AVGO) today announced its commitment to open computing at the 2019 Open Compute Project (OCP) Global Summit being held March ...
Test Open Compute Project NIC 3.0 devices with PCIe ®, NVMe ®, or CXL™ at speeds up to 64GT/s The OCP NIC 3.0 specification defines a community driven open standard for network adapters with the goal ...
TE Connectivity (TE) recently introduced its new Sliver straddle-mount connectors that are the new standard form factor supporting a faceplate-pluggable Open Compute Project (OCP) NIC 3.0. A new ...
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