A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Meal kits are notorious for their packaging problem: A typical delivery might come with insulation, gel-filled icepacks, and tiny containers or bags holding individual ingredients–like a few leaves of ...

In today’s competitive retail landscape, packaging has evolved far beyond its basic purpose of protection. It has become a ...

Dezeen Competitions: The Salmon Packaging Design Competition tasks designers with creating innovative packaging using corrugated cardboard sourced from sustainable and renewable materials. The ...