EDN

System-in-Package May Replace SOC

As integrated system-on-chip (SOC) size demands and development costs skyrocket, manufacturers are searching for viable alternatives. System-in-package (SiP) has emerged as a contender, but the ...
EDN

SoC package design takes ‘bottom-up’ tack

As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...
Electronic Design

System-in-Package Simplifies Multicore SoC Deployment

To make a multicore SoC like STMicro’s work most effectively, it of course needs a PCB as well as the required components, preferably packaged into one solution much like Octavo’s OSD32MP1 SiP. 1. The ...