Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on substrate (CoWoS) advanced packaging technology provided by TSMC. Huang ...

More importantly, TSMC reported revenue growth of 58% and 34% in the final two months of 2024. As Nvidia's fiscal fourth quarter of 2025 coincides with these three months, there is a solid chance that ...

ASE Technology Holding Co., the world's largest chip packaging and testing provider, said on Thursday it expects its revenue ...

The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

SK hynix has tapped Vice President Lee Woong-sun to spearhead its advanced chip packaging plant in the US. Lee has been ...

Tung said 75% will come from leading edge packaging and 25% from advanced testing. ASE’s subsidiary, Siliconware Precision Industries, has been a key supplier to Nvidia for the past 27 years.