March 14 (Reuters) - TOPPAN Holdings Inc: * TOPPAN - TO BUILD NEW FLIP CHIP BALL GRID ARRAY (FC-BGA) SUBSTRATE PLANT IN SINGAPORE, AIMS TO START PRODUCTION IN END ...
Santa Clara, Calif. – Emulation Technology will display its 0.5-mm lead-pitch ball grid array, chip-scale package, MicroBGA and land grid array production and development sockets at Wescon. The new ...
Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...
Upgrading CPUs in office computers makes a great deal of sense given that while CPU technology has advanced greatly, other components live longer lives before they become obsolete. Upgrading poses a ...
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