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BRIEF-Toppan: To Build New Flip Chip Ball Grid Array (FC-BGA) Substrate Plant In Singapore, Aims To Start Production In End-2026

March 14 (Reuters) - TOPPAN Holdings Inc: * TOPPAN - TO BUILD NEW FLIP CHIP BALL GRID ARRAY (FC-BGA) SUBSTRATE PLANT IN SINGAPORE, AIMS TO START PRODUCTION IN END ...
EDN

Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array

Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...
Electronic Design

Production Sockets Handle 0.50 mm Chip Packages

A family of 0.50 mm lead-pitch sockets is intended for production, development, test and debug where a finer pitch socket is needed. Sockets available are a ball-grid array (BGA), chip-scale package ...
EDN

Adjustable Pressure Pad on New Aries Electronics’ CSP Test Socket Enables Testing of Extremely Small and Fragile Devices without Damage

Bristol, Pa. – Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its 27mm CSP (chip scale package)/MicroBGA (ball grid array) ...