This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

Artificial intelligence is rapidly reshaping the way printed circuit boards (PCBs) are designed, validated, and optimised.

Most electronic assembly lines produce some defects, or faults. For example, solder-paste printers may deposit excess, smudged, or insufficient quantities of solder, and component pick-and-place ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

Sensor is set to enhance precision manufacturing, delivering micrometre-level point-cloud data, ultra-fast frame rates and ...

Manufacturers of advanced PCB assemblies know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success. Driven by advancing ...