A new logic-level approach directly impacts board-level performance and complexity. By optimizing interconnects, fanouts and signal structures before schematic capture, a new gate-level synthesis ...

What’s different about electrostatic discharge in stacked-die architectures.

According to the DfS insight, an instant analysis would indicate that this straightforward change could reduce PCB costs by 15 to 20% without impacting the prototype’s performance. This adjustment not ...