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Intel: The disintegration of a semiconductor giant?
The media reports about Intel’s talks with TSMC and Broadcom to sell its foundry and CPU design businesses, respectively, ...
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Infineon expands package choices for SiC MOSFETs
Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging ...
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Diodes afford ESD protection for automotive networks
PESD1ETH10 diodes deliver single-line ESD protection up to 18 kV (IEC 61000-4-2) and up to 15 kV for 1000 discharges (Open ...
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Software enables seamless IoT device management
Ready.IOT software building blocks offer secure IoT connectivity from aReady.COM computer-on-modules to the cloud.
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u-blox grows Bluetooth LE module portfolio
New variants in the u-blox Nora-B2 Bluetooth LE 6.0 module family integrate Nordic’s entire nRF54L series of ultra-low power ...
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QuickLogic enhances eFPGA design tool
Version 2.9 of the Aurora embedded FPGA tool suite from QuickLogic enables seamless integration of block RAM and DSP ...
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Why RISC-V is a viable option for safety-critical applications
How the RISC-V architecture’s inherent traits align with the demands of functional safety standards like ISO 26262.